 |

Dr. Jack Lau obtained his BS and MS degrees in Electrical Engineering from the University of California at Berkeley under the Honors Degree Program (Option H). He completed his PhD degree in 1994 and became the first PhD graduate and one of the founding members of the Hong Kong University of Science and Technology.
While at Berkeley, he worked at Hewlett Packard as a technical support intern and at Schlumberger as an automatic test equipment engineer. After obtaining his MS degree, he worked as a CPU design engineer at the Integrated Information Technology Santa Clara, California. His PhD thesis was on integrated magnetic sensors in both bulk silicon and SOI technologies. From 1995-1996, he was a Visiting Scholar at the Center for Integrated Systems at Stanford University researching in RF CMOS circuits and substrate noise coupling issues. Dr. Jack Lau was an Associate Professor in the Department of Electrical and Electronic Engineering of the HKUST, dedicating his research efforts in advanced electronics design and has published nearly 50 International journals and conference papers. He is a recipient of the UC Berkeley Alumni Scholarship, Cray Research Scholarship, Unisys Scholarship, and other awards. In 1995, he received the 1995 School of Engineering Faculty Teaching Appreciation Award. He is also a member of IEEE, Eta Kappa Nu, and Tau Beta Pi. He received the 10 Most Outstanding Young Person Award in Hong Kong and the Young Industrialist Award of Hong Kong in 2000 and 2005 respectively. |